Documentation

For the past couple of decades numerous methods have been used to adapt frequency-domain behaviors to the time-domain environment using SPICE circuit modeling techniques. This White Paper will discuss the creation of SPICE Models that accurately account for frequency dependent conductor and dielectric losses via a two-step process: (1) by first using the Boundary Element Method (BEM) to solve the field equations and automatically generate a report as well as a new universal frequency dependent lossy SPICE model, and (2) using the resultant SPICE sub-circuit to accurately simulate both a time and frequency domain response within any SPICE platform.

An overview of all technology produced by Interactive Products. You can read some background information on the founders of IPC and programmers of the tools.

Our presentation on the IFS SI tool suite from the IEEE EMC Conference, containing thorough documentation on the uses of IFS Pro and its inner-workings.

A presentation at the Transmission Line & Interconnect Seminar presented by Dr. Richard Elco and sponsored by IPC. Read about the following key points in this documentation:

Electrical Transmission Line Structures