Details for PCB West Presentation

PropertyValue
Name:PCB West Presentation
Description:

For the past couple of decades numerous methods have been used to adapt frequency-domain behaviors to the time-domain environment using SPICE circuit modeling techniques. This White Paper will discuss the creation of SPICE Models that accurately account for frequency dependent conductor and dielectric losses via a two-step process: (1) by first using the Boundary Element Method (BEM) to solve the field equations and automatically generate a report as well as a new universal frequency dependent lossy SPICE model, and (2) using the resultant SPICE sub-circuit to accurately simulate both a time and frequency domain response within any SPICE platform.

Filename:SPICE-Loss-Models-pcb-west-2003-5.pdf
Filesize: 370.76 kB
Filetype:pdf (Mime Type: application/pdf)
Last updated on: 12/22/2009 18:29
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