| Property | Value |
| Name: | PCB West Presentation |
| Description: | For the past couple of decades numerous methods have been used to adapt frequency-domain behaviors to the time-domain environment using SPICE circuit modeling techniques. This White Paper will discuss the creation of SPICE Models that accurately account for frequency dependent conductor and dielectric losses via a two-step process: (1) by first using the Boundary Element Method (BEM) to solve the field equations and automatically generate a report as well as a new universal frequency dependent lossy SPICE model, and (2) using the resultant SPICE sub-circuit to accurately simulate both a time and frequency domain response within any SPICE platform. |
| Filename: | SPICE-Loss-Models-pcb-west-2003-5.pdf |
| Filesize: | 370.76 kB |
| Filetype: | pdf (Mime Type: application/pdf) |
| Last updated on: | 12/22/2009 18:29 |
| Homepage: | http://www.Interactive-Products.com/ |